A: Plasma is the fourth state of matter — an ionized gas made up of free electrons, ions, radicals, and excited molecules. In plasma processing, these active species interact with solid surfaces to enable a range of surface modifications, such as etching, activation, deposition, and coating. PlasmaNano systems harness these effects to treat materials efficiently, precisely, and at low temperatures.

A: Plasma is widely used in industries such as the semiconductor, clean energy, aerospace, biomedical devices, and environmental management sectors. Its applications include:

Our reactors support multiple plasma types — DC, RF, microwave, and more — depending on the desired process and material.

A: Our systems can process nearly any material, including:

Thanks to low-processing temperatures and near-ambient pressure operation, even heat-sensitive and flexible substrates can be treated effectively.

A: Most PlasmaNano systems require only standard utility power (110V or 208V), a compressed gas source, and a simple exhaust system. No harsh chemicals or complex scrubbing infrastructure are required.

A: Through high plasma efficiency and compatibility with roll-to-roll manufacturing, our reactors deliver fast, continuous processing. Actual throughput depends on material type and treatment goals. We work closely with customers to optimize speed and scalability for their specific use case.

A: Our patent-pending reactor design offers:

A: PlasmaNano reactors are built for industrial integration. They are energy-efficient, compact, and capable of roll-to-roll or batch processing, making them ideal for high-throughput manufacturing lines across diverse industries.

A: Our systems are designed for low operational costs, with reduced electricity and gas consumption. Minimal waste heat means lower maintenance and higher system reliability compared to traditional plasma tools.

A: Our systems operate between 50°C and 150°C, allowing precise surface treatment of polymers, biomaterials, membranes, and other heat-sensitive materials.

A: Surface activation typically begins to degrade gradually after treatment, but often remains more reactive than untreated surfaces. The longevity depends on the material type and storage conditions. We’re happy to help assess performance in your specific workflow.

A: Yes. Our systems can accommodate nonflat, curved, and 3D structures. Custom electrode configurations allow for uniform treatment of complex geometries.

A: No. Plasma modifies only the surface — typically at the nanometer or monolayer scale. The material’s bulk properties, strength, or structure remain unchanged.

A: Yes. Plasma processing is a dry, clean technology. We use nontoxic gases, and any reactive species return to inert states shortly after exiting the chamber. Our systems are engineered with safety controls and low emissions, minimizing environmental, health, and safety risks.